SmartDV’s USB 3.x OTG IP is a silicon-proven, fully featured Universal Serial Bus SuperSpeed On-The-Go solution purpose-built for SoC designs requiring flexible, dual-role USB connectivity across mobile, automotive, IoT, and high-performance embedded applications. Fully compliant with USB 3.0, 3.1, and 3.2 specifications and xHCI v1.0, it delivers a comprehensive USB 3.x OTG implementation supporting SS-OTG, SSPC-OTG, SS-PO, and SS-EH device types at SuperSpeed Gen1 (5 Gbps), SuperSpeedPlus Gen2 (10 Gbps), and dual-lane SuperSpeedPlus Gen2x2 (20 Gbps) — providing a proven, production-ready USB 3.x OTG solution for the most demanding embedded SoC designs.
Designed to address the full breadth of USB 3.x OTG integration requirements, the IP implements the complete OTG protocol suite including SRP, HNP, ADP, and RSP with comprehensive timeout condition handling, all OTG feature selectors, and full SSPC-OTG to SS-OTG device communication combinations. Its complete USB 3.x feature progression from USB 3.0 through USB 3.2 dual-lane operation, split transfer support for FS/LS devices in Embedded Host Mode, configurable downstream ports for Embedded Host applications, and comprehensive power management give SoC teams a production-tested, feature-complete USB 3.x OTG implementation suited for the most demanding mobile and embedded dual-role USB designs.
Built for design flexibility and silicon efficiency, the IP core is highly configurable for both ASIC and FPGA implementations, with a strong focus on area optimization, power management, and peak performance. Its configurable PIPE interface, xHCI-compliant host controller, and clean host interface enable fast integration and confident design bring-up across a wide range of process nodes and target applications.
