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Overview

SmartDV’s USB 3.x Hub IP is a silicon-proven, fully featured Universal Serial Bus SuperSpeed hub solution purpose-built for SoC designs requiring high-performance USB hub functionality across embedded, automotive, AI/ML, and high-performance computing applications. Fully compliant with USB 3.0, 3.1, and 3.2 specifications and xHCI v1.0, it delivers complete hub-side USB functionality supporting SuperSpeed Gen1 at 5 Gbps, SuperSpeedPlus Gen2 at 10 Gbps, and dual-lane SuperSpeedPlus Gen2x2 at 20 Gbps with optional USB Type-C connector interface support, providing a proven, production-ready USB 3.x hub implementation for the most demanding embedded SoC designs.

Designed to address the full breadth of USB 3.x hub integration requirements, the IP implements complete downstream and upstream traffic ordering and buffering rules, the full USB 3.x feature progression from USB 3.0 ADP/HNP/SRP support through USB 3.1 SuperSpeedPlus LBPM and 128b/132b encoding to USB 3.2 dual-lane operation, deskew buffer, data striping, and comprehensive retimer support. Its xHCI-compliant implementation, configurable PIPE interface widths, LFPS signaling and SCD/LBPM messaging, all SS/SSP Link Power Management states U1/U2/U3, and Precision Time Measurement give SoC teams a production-tested, feature-complete USB 3.x hub covering the full USB 3.x specification evolution.

Built for design flexibility and silicon efficiency, the IP core is highly configurable for both ASIC and FPGA implementations, with a strong focus on area optimization, power management, and peak performance. Its configurable PIPE interface, optional Type-C connector interface, Master and Slave loopback mode for PHY testing, and clean host interface enable fast integration and confident design bring-up across a wide range of process nodes and target applications.

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USB 3.x Hub
Benefits
  • Full USB 3.x Hub Functionality – Complete hub implementation per USB 3.2 supporting Gen1 (5 Gbps, single lane, 8b/10b), Gen2 (10 Gbps, 128b/132b), and Gen2x2 (20 Gbps, dual lane) with full backward compatibility across USB 3.0, 3.1, and 3.2
  • Complete Traffic Ordering and Buffering – Full implementation of all downstream and upstream flowing traffic ordering and buffering rules for standards-compliant hub operation
  • All USB Transfer Types – Interrupt, Bulk, Isochronous, and Control transfers with Bulk Streaming, Type 1 and Type 2 buffer support for SSP, and separate endpoint buffers for IN and OUT bound packets
  • SuperSpeedPlus Gen2 Features – LFPS Based PWM Message (LBPM), SCD1/SCD2 LFPS patterns, Precision Time Measurement, transaction reordering, Length field replica, Endpoint companion descriptor, and Type-A and Type-B credit support
  • USB 3.2 Dual-Lane Features – Dual-lane operation with deskew buffer, data striping, Configuration summary descriptor, link and soft error count, and complete Retimer support including SRIS, Bit-Level Retimer, RTSM states, and Retimer presence announcement via LBPM
  • OTG Protocol Support – ADP, HNP, SRP, and RSP support with LCRD_A to LCRD_D credits for complete USB 3.0 OTG hub compatibility
  • Optional USB Type-C Connector Interface – Configurable Type-C connector interface support for next-generation USB hub system designs
  • Configurable PIPE Interface – 8, 16, and 32-bit PIPE interface width with scrambler/descrambler, lane polarity inversion, LFPS signaling, and SCD/LBPM messaging support
  • Comprehensive Power Management – SS/SSP Link Power Management states U1/U2/U3, LFPS for initialization, PTM support, USB Suspend with Remote Wakeup, and system Sleep/Hibernate/Warm/Cold Boot with clock gating and multi-power-well support
Compliance and Compatibility
  • Fully compliant with USB 3.2 specification; backward compatible with USB 3.1 and USB 3.0
  • Compliant with xHCI Specification v1.0
  • Supports Gen1 (5 Gbps), Gen2 (10 Gbps), and Gen2x2 (20 Gbps) operating modes
  • Optional support for USB Type-C connector interface
  • Compatible with PIPE interface in 8, 16, and 32-bit widths
  • Configurable SoC interface supporting AMBA AXI, AHB, APB, and custom wrappers for seamless integration
  • Compatible with ASIC and FPGA design flows across leading foundry process nodes
  • Compatible with all major EDA synthesis, simulation, and linting flows

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