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Overview

SmartDV’s MIPI I3C Master IP is a silicon-proven, fully featured I3C controller solution purpose-built for SoC designs requiring efficient, low-pin-count peripheral connectivity across mobile, IoT, automotive, and data center applications. Fully compliant with MIPI I3C v1.2 and optionally with MIPI I3C HCI v1.2, it delivers complete master-side I3C functionality with backward compatibility for legacy I2C devices, enabling seamless integration of sensors, power management ICs, and other peripherals over a unified two-wire bus interface.

Beyond standard I3C master functionality, the IP provides comprehensive support for JEDEC Module Sideband Bus v1.0 and MCTP I3C Transport Binding v0.3.0, making it a versatile solution for server, memory module, and data center management applications alongside its core mobile and IoT use cases. Its dual PIO and DMA operating modes, predictive addressing scheme, and I3C address arbitration optimization give SoC teams a production-tested, feature-complete master implementation that minimizes software overhead while maximizing bus efficiency.

Built for design flexibility and silicon efficiency, the IP core is highly configurable for both ASIC and FPGA implementations, with a strong focus on area optimization, power management, and peak performance. Its parameterized architecture, optional HCI interface for OS-level driver compatibility, and clean host interface enable fast integration and confident design bring-up across a wide range of process nodes and target applications.

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MIPI I3C Master
Benefits
  • Full MIPI I3C Master Functionality – Complete master-side implementation per MIPI I3C v1.2 with SDR and HDR-DDR messaging, Dynamic Address Assignment, CCC support, and legacy I2C device co-existence
  • Optional I3C HCI v1.2 Support – Host Controller Interface for OS-level generic I3C driver compatibility including Scheduled Commands, Secondary Controller, and Dead Bus Recovery
  • Dual Operating Modes – PIO Mode with Command, Response, and IBI queues and DMA Mode with Command Rings, multiple Command/Response Rings, and IBI Rings for flexible host integration
  • Advanced Interrupt Management – In-Band Interrupt and Hot-Join interrupt support with Auto-Reject, interrupt masking, and IBI payload handling for efficient event-driven operation
  • JEDEC and MCTP Support – JEDEC Module Sideband Bus v1.0 compliance with PEC support and MCTP I3C Transport Binding v0.3.0 with fairness arbitration, SDA stuck low recovery, and NACK retry timer
  • Flexible Addressing – Predictive addressing scheme, I3C address arbitration optimization, Direct commands with CCC framing, and Static Addressing for legacy I2C devices
  • Extended Register Support – Extended Capability Registers, Vendor specific registers, and JEDEC specific CCC transfers for broad ecosystem compatibility
  • Legacy I2C Compatibility – Fast Mode and Fast Mode Plus I2C support on shared bus for seamless integration with existing I2C peripheral ecosystems
Compliance and Compatibility
  • Fully compliant with MIPI I3C v1.2 specification
  • Optional support for MIPI I3C HCI v1.2 specification
  • Compliant with JEDEC Module Sideband Bus v1.0 specification
  • Compliant with MCTP I3C Transport Binding v0.3.0 specification
  • Configurable SoC interface supporting AMBA AXI, AHB, APB, and custom wrappers for seamless integration
  • Compatible with ASIC and FPGA design flows across leading foundry process nodes
  • Compatible with all major EDA synthesis, simulation, and linting flows

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