SmartDV’s MIPI UniPro 3.x Controller IP is a next-generation interconnect solution engineered for the most demanding SoC applications in mobile, automotive, AI/ML, and high-performance embedded systems. Fully compliant with MIPI UniPro v3.0 and MIPI M-PHY v6.0 specifications and backward compatible with UniPro v2.0 and v1.8, it delivers ultra-high-speed, low-latency communication between chipsets and peripheral components at up to 46.6 Gbps per lane. Designed as the interconnect backbone for UFS 5.0 storage subsystems, it provides a robust, future-ready foundation for next-generation storage interface designs.
As the interconnect layer for JEDEC UFS 5.0, UniPro v3.0 introduces significant advances in signal integrity, error correction, and link reliability that are essential for operating at HS-G6 speeds. SmartDV’s UniPro 3.x Controller IP gives SoC teams a complete, spec-accurate implementation of these advances including Transport Framing Structure, Reed-Solomon forward error correction, and link equalization training, without the complexity of building them from scratch.
Built for design flexibility and silicon efficiency, the IP core is highly configurable for both ASIC and FPGA implementations, with a strong focus on area optimization, power management, and peak performance. Its parameterized architecture and broad backward compatibility across UniPro and M-PHY versions enable fast integration into both new and existing SoC architectures targeting next-generation UFS 5.0 storage applications.
