SmartDV’s AXI Multilayer Interconnect IP is a silicon-proven, high-performance AMBA AXI bus fabric solution purpose-built for SoC designs requiring high-throughput, low-latency multi-master interconnect across AI/ML accelerators, automotive SoCs, high-performance computing, and data center application designs. Fully compliant with the ARM AMBA AXI5 Protocol Specification and backward compatible with AXI4, AXI4-Lite, and AXI3, it delivers complete master and slave connectivity with all standard data and address widths, separate address, data, and response phases, separate read and write channels, and support for multiple outstanding transactions with no strict timing relationship between address and data operations.
Designed to maximize bandwidth in multi-master SoC designs, the IP supports all AXI protocol transfer types, burst types, burst lengths, burst sizes, and response types, alongside narrow transfer support, unaligned address access, and burst-based transactions with only start address issued. Its ability to support multiple simultaneous outstanding transactions across independent read and write channels gives SoC interconnect teams a production-tested, high-performance AXI multilayer fabric that handles the most demanding AI and data center interconnect bandwidth requirements.
Built for design flexibility and silicon efficiency, the IP core is highly configurable for both ASIC and FPGA implementations, with a strong focus on area optimization, power management, and peak performance. Its parameterized master and slave count, configurable bus widths, and clean integration interface enable fast design bring-up across a wide range of process nodes and target applications.
