SmartDV’s AHB Multilayer Interconnect IP is a silicon-proven, high-performance AMBA AHB bus fabric solution purpose-built for SoC designs requiring high-throughput, low-latency multi-master interconnect across embedded processor, memory controller, and peripheral subsystem designs. Fully compliant with the AMBA AHB5 specification, it supports up to 16 masters and 16 slaves with per-slave round-robin or priority-based arbitration, user-defined slave-to-master mapping, and arbitration performed at each slave port — delivering higher throughput and lower arbitration overhead compared to centralized arbitration schemes.
Designed to maximize bandwidth in multi-master SoC designs, the IP provides a standardized user interface for easy integration with any IP, control logic mapping user interface signals to AHB signals, configurable data and address bus widths, user-defined slave address mapping per master, and support for all protocol transfer types, burst transfers, and response types. Its support for locked transfers, early burst termination on error response, two-cycle error response in slave, and configurable wait state generation gives SoC interconnect teams a production-tested, feature-complete AHB multilayer fabric that handles the most demanding multi-master bandwidth requirements.
Built for design flexibility and silicon efficiency, the IP core is highly configurable for both ASIC and FPGA implementations, with a strong focus on area optimization, power management, and peak performance. Its parameterized master and slave count, configurable arbitration scheme, and clean integration interface enable fast design bring-up across a wide range of process nodes and target applications.
