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AXI Multilayer Interconnect IP
Design IP
Overview

SmartDV’s AXI Multilayer Interconnect IP is a high-throughput, silicon-proven solution designed to manage complex on-chip communication between multiple AXI masters and slaves. It enables efficient data transfer across heterogeneous subsystems in SoCs, supporting scalable bandwidth and low-latency interconnect fabric for high-performance designs.

Designed for flexibility, the IP core is highly configurable to meet specific design requirements, supporting both ASIC and FPGA implementations while optimizing for area, power, and performance. Ideal for a wide range of applications, including AI/ML, automotive, and consumer electronics, the AXI Interconnect IP ensures seamless integration and robust performance in demanding system architectures.

Benefits
  • Comprehensive Protocol Support – Handles all AXI4 data and address widths, transfer types, burst types, burst lengths, and response types
  • Efficient Channel Architecture – Implements separate address, data, and response phases with independent read and write channels for maximum concurrency
  • Burst Transaction Optimization – Supports burst-based transfers with only the start address required, reducing control overhead
  • Flexible Transfer Handling – Supports narrow transfers and unaligned address accesses to enable broader system compatibility
  • High Transaction Throughput – Allows multiple outstanding transactions for improved parallelism and bus utilization
  • Relaxed Timing Constraints – No strict timing relationship between address and data phases, simplifying integration and timing closure
Compliance and Compatibility
  • Fully compliant with ARM AMBA 3, and AMBA 4 AXI specifications
  • Compatible with all major EDA synthesis, simulation, and linting flows