HBM2 Controller IP

Design IP

Overview

SmartDV’s HBM2 (High Bandwidth Memory) Controller IP delivers high-speed, low-latency access to stacked DRAM, making it an ideal solution for AI, HPC, networking, and graphics applications that demand extreme memory bandwidth. Supporting both JEDEC-standard HBM2 and HBM2E specifications, the controller ensures seamless integration into complex SoC architectures while maximizing data throughput and efficiency.

Designed for flexibility, the IP core is highly configurable to meet specific design requirements, supporting both ASIC and FPGA implementations while optimizing for area, power, and performance. Advanced features such as AXI interface support, robust error correction, and intelligent bank and channel management make it a dependable choice for next-generation high-performance systems.

Benefits

Comprehensive HBM2 and HBM2E Protocol Support – Fully supports JESD235, JESD235A/B/C/D specifications and compliant with DFI 4.0 and 5.0 standards.
High-Performance Architecture – Achieves high clock speeds on both ASIC and FPGA with low-latency read/write paths and efficient command scheduling.
Scalable Multi-Channel Design – Supports up to 8 channels per stack and up to 16 AXI ports with data width up to 512 bits for flexible system scaling.
Advanced Transaction Control – Provides programmable outstanding transactions, in-port and multi-port arbitration, and command reordering for maximum throughput.
Configurable Page and Timing Policies – User-programmable open/closed-page policy and adjustable read/write latency for performance optimization.
Extensive Memory Feature Set – Implements bank grouping, burst length 2 and 4, extended addressing, DRAM clock disable, and Data Bus Inversion (DBI) for efficient access.
Enhanced Reliability and Error Handling – Includes ECC pin support, error signaling, parity checking, and detection of timing and protocol violations.
Low-Power Operation – Supports clock gating, power-down, self-refresh, and temperature-compensated refresh for power-efficient designs.
Flexible PHY Interface – Supports 1:1 and 1:2 MC-to-PHY frequency ratios, DFI read/write chip select, and data mask features for smooth PHY integration.
Seamless SoC Integration – Provides standard AXI/ACE interfaces and IEEE 1500 compatibility, ensuring easy integration into complex SoCs.

Compliance and Compatibility

Fully compliant with JEDEC JESD235 (HBM2) and JESD235B/C/D (HBM2E) specifications
Compliant with DFI 4.0 and 5.0 interface standards
Compatible with all major EDA synthesis, simulation, and linting flows

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