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Overview

SmartDV’s PCIe 3.1 Controller IP is a silicon-proven, fully featured PCI Express interconnect solution purpose-built for SoC designs requiring high-bandwidth, low-latency connectivity across embedded, automotive, AI/ML, and high-performance computing applications. Fully compliant with the PCI-SIG PCIe 3.1 specification, it delivers complete Root Complex and Endpoint controller functionality at 8 GT/s per lane with 128b/130b encoding and support for link widths up to x16, providing a proven, production-ready PCIe interconnect foundation for demanding storage, networking, and GPU connectivity applications.

Designed for the performance and integration requirements of modern high-bandwidth SoC designs, the IP implements the complete LTSSM state machine, data scrambling, full link speed and width negotiation, and a comprehensive transaction layer supporting up to 8 Virtual Channels and 8 Traffic Classes with configurable TC to VC queue mapping. Its silicon-proven status across multiple customer designs gives SoC teams the integration confidence and production readiness that reduces design risk and accelerates time to market in competitive PCIe 3.0 deployments.

Built for design flexibility and silicon efficiency, the IP core is highly configurable for both ASIC and FPGA implementations, with a strong focus on area optimization, power management, and peak performance. Its PIPE interface compatibility, Lane Margining at Receiver support, and clean host interface enable fast integration and confident design bring-up across a wide range of process nodes and target applications.

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PCIe Controller
Benefits
  • Full PCIe 3.1 Root Complex and Endpoint Support – Complete controller implementation per PCI-SIG PCIe 3.1 specification at 8 GT/s with 128b/130b encoding and support for link widths up to x16
  • Complete LTSSM State Machine – Full Link Training and Status State Machine with speed and link width negotiation, lane polarity inversion, lane reversal detection and correction, and data scrambling
  • Comprehensive Transaction Layer – Up to 8 Virtual Channels with configurable depth queuing, up to 8 Traffic Classes, configurable TC to VC mapping, and multi-function support
  • Robust Data Integrity – LCRC, DLLP field checking, TLP header and prefix validation, ECRC support, and retry mechanism for reliable data transfer
  • Advanced Power Management – ASPM, software-controlled power management, Link Power Management, L1 PM Sub-states, and Emergency Power Reduction State support
  • Lane Margining at Receiver – Hardware lane margining support for improved signal integrity validation and debug
  • 10-Bit Tag and Enhanced Allocation – 10-Bit Tag Requester and Enhanced Allocation support for increased outstanding transaction capacity
Compliance and Compatibility
  • Fully compliant with PCI-SIG PCIe 3.1 specification; backward compatible with PCIe 3.0, 2.1, 2.0, and 1.0
  • Supports PIPE interface for PHY integration
  • Configurable SoC interface supporting AXI, AHB, APB, and custom wrappers for seamless integration
  • Compatible with ASIC and FPGA design flows across leading foundry process nodes
  • Compatible with all major EDA synthesis, simulation, and linting flows

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