HBM3 Controller IP

Design IP

Overview

SmartDV’s HBM3 Controller IP delivers a high-bandwidth, low-latency memory interface solution tailored for high-performance computing, AI/ML acceleration, and data-intensive applications. Designed to meet the latest HBM3 JEDEC standards, it enables efficient management of stacked DRAM devices with speeds up to 6.4 Gbps per pin, supporting multi-channel and pseudo-channel architectures.

Designed for flexibility, the IP core is highly configurable to meet specific design requirements, supporting both ASIC and FPGA implementations while optimizing for area, power, and performance. It includes advanced features such as configurable AXI/Native interfaces, built-in ECC, and robust command and timing control mechanisms, making it ideal for next-generation memory subsystems.

Benefits

Comprehensive HBM3 Protocol Support – Supports JEDEC JESD238, JESD238A, and JESD238A_v1.50a specifications, with compliance to DFI 4.0 and 5.0 standards.
Ultra-High Bandwidth and Scalability – Achieves multi-terabit throughput with up to 16 channels per stack, 64 DQ width (plus optional ECC), and channel densities up to 32 GB.
Advanced Command and Transaction Control – Features programmable outstanding transactions, multi-port arbitration, and out-of-order reordering for maximum performance.
Configurable Timing and Page Policies – User-programmable open/closed-page policy, adjustable read/write latency, and programmable operating frequency for fine-tuned performance.
Optimized Data Path and Low Latency – Delivers high clock speeds and low-latency read/write access suitable for high-performance ASIC and FPGA designs.
Flexible Architecture and PHY Interface – Supports 1:1, 1:2, and 1:4 MC-to-PHY ratios with DFI read/write chip select, pseudo channel mode (two pseudo channels per channel), and WDQS-to-CK training.
Comprehensive Memory Feature Set – Includes burst length 8, bank grouping, 64 banks per pseudo channel, semi-independent row/column commands, and 2 KB page size per channel.
Enhanced Reliability and Integrity – Provides ECC, error signaling, command/address and data parity, data mask, strobe, and Data Bus Inversion (DBIac) for robust error management.
Low-Power and Thermal Efficiency – Incorporates self-refresh, power-down, clock-stop, and temperature-compensated refresh modes for energy-efficient operation.
SoC and Test Integration Ready – Supports IEEE 1500 compliance and bus-accurate timing (min/max/typical), ensuring seamless integration into complex SoC environments.

Compliance and Compatibility

Fully compliant with JEDEC JESD238, JESD238A, and JESD238A_v1.50a HBM3 specifications
Compliant with DFI 4.0 and 5.0 interface standards
Compatible with all major EDA synthesis, simulation, and linting flows

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