SmartDV’s HBM3 Controller IP delivers a high-bandwidth, low-latency memory interface solution tailored for high-performance computing, AI/ML acceleration, and data-intensive applications. Designed to meet the latest HBM3 JEDEC standards, it enables efficient management of stacked DRAM devices with speeds up to 6.4 Gbps per pin, supporting multi-channel and pseudo-channel architectures.

Designed for flexibility, the IP core is highly configurable to meet specific design requirements, supporting both ASIC and FPGA implementations while optimizing for area, power, and performance. It includes advanced features such as configurable AXI/Native interfaces, built-in ECC, and robust command and timing control mechanisms, making it ideal for next-generation memory subsystems.