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APB Multilayer Interconnect
Design IP
Overview

SmartDV’s APB (Advanced Peripheral Bus) Multilayer Interconnect IP enables efficient communication between multiple APB masters and slaves, streamlining peripheral access in complex SoC designs. Ideal for low-bandwidth control path communications, it supports parallel transactions and arbitration mechanisms to ensure low-latency and high-throughput data transfers.

Designed for flexibility, the IP core is highly configurable to meet specific design requirements, supporting both ASIC and FPGA implementations while optimizing for area, power, and performance.

AMBA Multilayer Interconnect
Benefits
  • Scalable Connectivity – Supports up to 16 masters and 16 slaves with user-defined master-slave mapping and per-master slave address configuration
  • Flexible Bus Configuration – Configurable data and address bus widths, with support for write strobe and configurable endianness
  • Optimized Arbitration – Selectable round-robin or priority-based arbitration per slave, reducing contention and improving throughput
  • Decentralized Control – Slave-side arbitration minimizes overhead by eliminating centralized arbitration bottlenecks
  • Protocol-Aware Operation – Supports all APB protocol transfer types, response types, and protected accesses
  • Customizable Integration – Standardized user interface signals with built-in control logic to simplify mapping to APB signals
  • Performance Enhancements – Wait-state insertion supported at slave interface to manage timing and system latency
Compliance and Compatibility
  • Compliant with AMBA 2, AMBA 3, and AMBA 4 APB specifications
  • Compatible with all major EDA synthesis, simulation, and linting flows