SmartDV’s USB 3.x Device IP is a silicon-proven, high-throughput solution designed for next-generation connectivity across high-performance computing, storage, and multimedia applications. Fully compliant with the USB 3.1 and USB 3.2 specifications, it supports SuperSpeed (5 Gbps) and SuperSpeed+ (10 Gbps) operation, enabling fast and reliable data transfers while maintaining backward compatibility with USB 2.0.

Designed for flexibility, the IP core is highly configurable to meet specific design requirements, supporting both ASIC and FPGA implementations while optimizing for area, power, and performance. Its advanced features include support for USB Link Training and Status State Machine (LTSSM), power management, and integrated PIPE interface support, ensuring seamless integration and robust USB device functionality.